US 4,792,517 : Laminate for the formation of beam leads for IC chip bonding

 

Inventors:

Klein, Gerald W. (Pittsford, NY)
Mcconkey, Robert C. (Rochester, NY)
Molaire, Michel F. (Rochester, NY)
Noonan, John M. (Rochester, NY) 

Assignee:

Eastman Kodak Company (Rochester, NY) 

A laminate, adapted for manufacturing frames of metal beam leads that are bonded to integrated circuit chips, comprises
(a) a flexible metal strip,
(b) a layer of a first resist adhered to one surface of the metal strip, and
(c) a layer of a second resist adhered to the opposite surface of the metal strip,
the second resist being a negative-working resist comprising
(1) a polymeric binder,
(2) a photopolymerizable monomer mixture, and
(3) a photoinitiator composition. The negative-working resist exhibits excellent flexibility and adhesion to the metal and superior performance during high temperature processing, whereby it serves effectively as a support for the beam leads.
http://www.freepatentsonline.com/4792517.pdf