US 4,792,517 : Laminate for the formation of beam leads for IC chip bonding



Klein, Gerald W. (Pittsford, NY)
Mcconkey, Robert C. (Rochester, NY)
Molaire, Michel F. (Rochester, NY)
Noonan, John M. (Rochester, NY) 


Eastman Kodak Company (Rochester, NY) 

A laminate, adapted for manufacturing frames of metal beam leads that are bonded to integrated circuit chips, comprises
(a) a flexible metal strip,
(b) a layer of a first resist adhered to one surface of the metal strip, and
(c) a layer of a second resist adhered to the opposite surface of the metal strip,
the second resist being a negative-working resist comprising
(1) a polymeric binder,
(2) a photopolymerizable monomer mixture, and
(3) a photoinitiator composition. The negative-working resist exhibits excellent flexibility and adhesion to the metal and superior performance during high temperature processing, whereby it serves effectively as a support for the beam leads.